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 RD3ST24
Standby Control IC
REJ03D0521-0200 Rev.2.00 Mar 01, 2006
Description
RD3ST24 is including the standby control circuit for a microcomputer in 8 pin packages. When MSTB input "Low", SWOUT output "Low", STBYOUT output become "High" and cancels standby condition. And RESOUT output becomes ''High'' after it passed period (t1*) when it is stable the oscillation that was set up with RC bill outside and cancel the reset condition of a microcomputer. Also when MSTB input "Low", RESOUT output becomes "Low" and makes reset condition. After the delay time (t2) of prescription passed subsequently, SWOUT output "High" STBYOUT output becomes "Low" and makes a microcomputer standby condition. *: t1 = K*RC (K is coefficient: Reference of application data)
Features
* * * * Supply voltage range: 2.3 to 5.5 V Temperature range: -40 to +85C Output current: 6mA (@VCC=3.0V), 12mA (@Vcc=4.5V) Ordering Information
Part Name RD3ST24USE Package Type SSOP-8 pin Package Code (Previous Code) PVSP0008KA-A (TTP-8DBV) Package Abbreviation US Taping Abbreviation (Quantity) E (3,000 pcs/reel)
Outline and Article Indication
* RD3ST24
Index band Lot No.
YMW S24
SSOP-8 Marking
Y : Year code (the last digit of year) M : Month code W : Week code
Rev.2.00 Mar 01, 2006 page 1 of 9
RD3ST24
Pin Arrangement
BATT SWOUT MSTB GND
1
8
Vcc RESOUT STBYOUT RxCx
2
3
4
7
6
5
Pin Description
Symbol BATT SWOUT MSTB GND RxCx STBYOUT RESOUT VCC Pin Name The battery power supply Output for Power MOS FET control Manual standby Input Ground Terminal for external resistance and capacitance Standby Output Reset Output Power supply
Rev.2.00 Mar 01, 2006 page 2 of 9
RD3ST24
Absolute Maximum Ratings
Item Supply voltage range Input voltage range *1 Output voltage range *1, 2 Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation 3 at Ta = 25C (in still air) * Storage temperature Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 -0.5 to 7.0 20 50 25 50 200 -65 to 150 Unit V V V mA mA mA mA mW C Test Conditions
Output: H or L VCC: OFF VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
Notes: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 6.0 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Output current Symbol VCC, BATT VI VO IOH IOL External resistance External capacitance Operating free-air temperature RX CX Ta Min 2.3 0.0 0.0 -- -- -- -- 1.0 -- -40 Typ -- -- -- -- -- -- -- -- Unlimited -- Max 5.5 VCC 5.5 -6 -12 6 12 -- -- 85 Unit V V V mA Conditions
VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V
k F C
Rev.2.00 Mar 01, 2006 page 3 of 9
RD3ST24
Electrical Characteristic
Ta = -40 to 85C
Item Input voltage Symbol VIH BATT VCC (V) (V) 2.50.2 3.30.3 5.00.5 2.50.2 3.30.3 5.00.5 3.0 3.0 4.5 VOL 3.0 4.5 Input current Output leakage current Quiescent supply current IIN IOFF 5.5 0 4.5 3.0 4.5 5.5 0 Min 0.7xVCC 0.7xVCC 0.7xVCC -- -- -- 2.9 2.48 4.4 3.8 -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max -- -- -- 0.3xVCC 0.3xVCC 0.3xVCC -- -- -- -- 0.1 0.44 0.1 0.55 10 10 Unit V Test condition
VIL
V
Output voltage
VOH
V
IOH=-100A IOH=-6mA IOH=-100A IOH=-12mA
V
IOL=100A IOL=6mA IOL=100A IOL=12mA
A A
VIN=0V or VCC, RXCX=GND VO=5.5V, RXCX=GND (RESOUT, STBYOUT, SWOUT) VIN=0V or VCC, RXCX=GND
ICC ICC (BATT)
5.5 5.5 0
5.5 5.5 5.5
-- -- --
-- -- --
10 10 10
A uA uA
Switching Characteristics
Ta = -40 to 85C
Item Propagation delay time Symbol t1 VCC (V) * 3.3
1
BATT (V) 3.3
Min 80 0.8 80 80 0.8 80 125 70
Typ 95 0.95 95 95 0.95 95 -- --
Max 110 1.1 110 110 1.1 110 250 160
Unit s ms ms s ms ms ns ns
Test condition RX=10k, CX=0.01F RX=10k, CX=0.1F RX=100k, CX=1.0F RX=10k, CX=0.01F RX=10k, CX=0.1F RX=100k, CX=1.0F
5.0
5.0
t2 Note: 1. Ta = 25C
3.3 5.0
3.3 5.0
Rev.2.00 Mar 01, 2006 page 4 of 9
RD3ST24
Timing Diagram
VCC MSTB GND t1 RESOUT VOL VOH STBYOUT t2 VOL VOH VOH
SWOUT VOL
Application Circuit
VCC=3.3V F
VCC BATT SWOUT MSTB GND Control IC (RD3ST24) VCC RESOUT STBYOUT RXCX 22k 22k RES STBY
F
Standerd Microcomputer
VOUT VDD
CDLY
VSS VMRN RESET IC
Notes: 1. CDLY terminal of RESET IC becomes shortest that delay time the setting. 2. VOUT of RESET IC is not connected to a direct microcomputer.
Rev.2.00 Mar 01, 2006 page 5 of 9
RD3ST24
Application Data
Vcc = 5.0 V 10000.0
1000.0
100.0
10.0 Rext 1.0
0.1 10
2
10
3
10
4
10
5
10
6
10
7
Timing capacitance Cext (pF)
Vcc = 3.3 V 10000.0
1000.0
100.0
10.0 Rext 1.0
0.1 10
2
10
3
10
4
10
5
10
6
10
7
Timing capacitance Cext (pF)
Rev.2.00 Mar 01, 2006 page 6 of 9
RD3ST24
1.1
Coefficient of output delay time K
Cext 1.0 100 pF 1000 pF 10000 pF 100000 pF 1000000 pF
0.9
0.8 2.3 2.5 2.7 3.0 3.3 3.6 4.5 5.0 5.5 Supply voltage VCC (V)
1.1
Coefficient of output delay time K
1.0
Cext 100 pF 1000 pF 10000 pF 100000 pF 1000000 pF
0.9
0.8 2.3 2.5 2.7 3.0 3.3 3.6 4.5 5.0 5.5
Supply voltage VCC (V)
Rev.2.00 Mar 01, 2006 page 7 of 9
RD3ST24
VCC = 3.3 (V) 500
Propagation delay time t2 (ns)
400
300
200
Ta (C) -55C -40C 25C 85C 125C
100
0 15 50 100 200 Capacitance C (pF) 500 1000 2000
VCC = 5.0 (V) 400
Propagation delay time t2 (ns)
300
200
Ta (C) -55C -40C 25C 85C 125C
100
0 15 50 100 200 Capacitance C (pF) 500 1000 2000
Rev.2.00 Mar 01, 2006 page 8 of 9
RD3ST24
Package Dimensions
JEITA Package Code P-VSSOP8-2.3x2-0.50 RENESAS Code PVSP0008KA-A Previous Code TTP-8DB/TTP-8DBV MASS[Typ.] 0.010g
D
1.5 0.2
F 5
8
bp
b1
c1
E
HE
Terminal cross section
c
1
4
L1
Reference Dimension in Millimeters Symbol
e
bp
( 0.17 )
Detail F
Min Nom Max D 1.8 2.0 2.2 E 2.2 2.3 2.4 A2 0.6 0.7 0.8 A1 0.1 0 A bp 0.15 0.22 0.3 b1 0.20 c 0.08 0.13 0.23 c1 0.11 HE 2.8 3.1 3.4 e (0.5) x y Z L L1 (0.4)
Rev.2.00 Mar 01, 2006 page 9 of 9
A1
A2
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


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